JIS Z Test methods for flat pallets (FOREIGN STANDARD). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. Standard (JIS Z ) was performed. From the obtained results, the possibility of practical application was exam- ined. Moreover, the manufacturing process of. JIS Z – JIS Z Test methods for flat pallets. Publication date: ; Original language: English. Please select.
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The parameter is the value of m. Arrhenius expressed the chemical jiw rate, K, experimentally as follows: Variance of normal distribution X0: The average probability of finding a mask defect within the area C approaches the probability that a mask defect exists on a point on the surface of the wafer.
As the device is subjected to more and more cycles of intermittent operation nas shown in figure B. Let us first examine a simple binomial distribution model to know concretely what the normal distribution expresses.
Chapter 5 – Basic Concepts of Probability. Math Statistics And Probability A.
JIS Z 0602:1988
That is, it is a non-maintainable component. The double exponential distribution is suitable for analysis of such kinds of phenomena.
If we take this current i as the device characteristic X discussed in B. If the amount of change in the characteristic value is found to be accelerated by thermal stress, in many cases the Arrhenius chemical reaction kinetics model can be applied to this phenomenon. Noting the relation expressed by Eqs. Such a system is known as a series system of redundancy of 0 figure B.
The reaction rate K using this model is given by the following expression: If the sampled device is not returned non-replacementwe will have a hypergeometric distribution.
These functions are shown in figure B.
A.1 AQL Sampling Table
We will not discuss the correctness of this in a strict mathematical sense. The AQL plan measures the lot whose fraction defective is p1 as having the lowest acceptable quality level. This is a parallel system with a redundancy of n -1 figure B. We deal with this issue in B.
JIS Z – Test methods for flat pallets (FOREIGN STANDARD)
In such a case, stress is applied locally to the device and the life or the withstanding limit of the device depends on its weak point. This is referred to as upper 20 percent point. The risk of this rejection implies the producer’s loss, so the risk is referred to as producer’s risk.
Let us assume that a given lot of semiconductor devices are storage tested at temperature T. This process is explained in detail as follows. Detailed discussions of the Poisson distribution are given below. When equipment can be repaired by renewing a failed device, the mean value of the interval that operation is possible between occurrences of failures is know as the MTBF Mean Time Between Failures. By inspecting n randomly sampled devices, x defective devices are detected with the probability fH – geo N, R, n, x.
To serve as an example, consider the life L in equation IX The values of p and q will be uniform for all test results. This is known as consumer’s risk. Unless otherwise specified, use Inspection Standard II. Here we assume that the phenomenon does not occur twice or more at the same instant, and further that the probability of the phenomenon occurring is constant. From one end of the wafer, each portion is inspected with a microscope.